Circuit board for high pin count surface mount pin grid arrays

A printed circuit board for high reliability mounting of surface mount pin grid array integrated circuit packages, said printed circuit board comprising:

• at least one mounting surface adapted to receive the surface mount pin grid array integrated circuit packages;
• a plurality of conductive surface-mount component-attachment pads disposed on said at least one mounting surface of the printed circuit board, groups of said pads arrayed in patterns to match the pin patterns of the surface mount pin grid array integrated circuit packages to be mounted thereon;
• a first solder mask layer disposed on said at least one mounting surface of the printed circuit board, said first solder mask layer having a plurality of first apertures defined completely therethrough, said first apertures substantially aligned with said pads so as to expose a portion of a top surface of said pads at bottoms of wells defined by vertical walls of said first solder mask layer defining said first apertures, said first apertures having a first cross-sectional area;
• a second solder mask layer disposed on said first solder mask layer having a plurality of second apertures defined completely therethrough, said second apertures substantially aligned with said pads so as to expose said portion of said top surface of said pads, said second apertures having a second cross-sectional area of magnitude greater than said first cross-sectional area.