Printed circuit board and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMi Jeong Jeon, Tae Hee Yoo, Hyun Seok Yang, In Jae Chung
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Abstract
A method of manufacturing a printed circuit board includes: forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer; forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings; and removing the first and second resist films. The first and second openings have different widths in a cross-section.
Claims16
A method of manufacturing a printed circuit board, the method comprising:
- forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer;
- forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings;
- and
- removing the first and second resist films,
- wherein
- the first and second openings have different widths in a cross-section, and
- the width of the first opening is greater than the width of the second opening, and the first resist film is disposed between the first metal layer and the second resist film.
A method of manufacturing a printed circuit board, the method comprising:
- forming first and second resist films, respectively having first and second openings exposing a first metal layer disposed on one surface of an insulating layer;
- forming a second metal layer on the first metal layer, exposed through the first and second openings, to fill at least a portion of each of the first and second openings;
- and
- removing the first and second resist films,
- wherein
- the first and second openings have different widths in a cross-section, and
- the width of the first opening is less than the width of the second opening, and the first resist film is disposed between the first metal layer and the second resist film.
A printed circuit board comprising:
- an insulating layer;
- a seed metal layer disposed on the insulating layer;
- and
- a metal post including a first metal portion, disposed on the seed metal layer, and a second metal portion disposed on the first metal portion,
- wherein
- the first and second metal portions are integrated with each other without a boundary therebetween,
- the first and second metal portions have different widths in a cross-section, and the seed metal layer is in contact with the first metal portion, but is spaced apart from the second metal portion,
- the first metal portion is a bottommost portion of the metal post, and the first metal portion and a portion of the seed metal layer that contacts the first metal portion have the same width.
Dependencies are inferred from the claim text.