Circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKyehwan Lee
Life of this patent
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Abstract
A circuit board includes: an insulating layer, a solder resist layer disposed on the insulating layer and having first and second openings; first and second connection pads respectively disposed within the first and second openings on the insulating layer; and first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses. Each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
Claims20
A circuit board comprising:
- an insulating layer;
- a solder resist layer disposed on the insulating layer and having first and second openings;
- first and second connection pads respectively disposed within the first and second openings on the insulating layer;
- and
- first and second conductive layers respectively disposed on the first and second connection pads, and configured to protrude more than an upper surface of the solder resist layer and to have different thicknesses,
- wherein each of the first and second conductive layers includes a lower conductive layer disposed on a corresponding one of the first and second connection pads and an upper conductive layer disposed on an upper surface of the lower conductive layer.
A manufacturing method of a circuit board, comprising:
- forming first and second connection pads on an insulating layer;
- forming a solder resist layer having first and second openings respectively overlapping the first and second connection pads on the insulating layer;
- and
- forming first and second conductive layers on the first and second connection pads, respectively, protruding more than an upper surface of the solder resist layer and having different thicknesses.
Dependencies are inferred from the claim text.