H05K 2203/0585
Second resist used as mask for selective stripping of first resist
H05K2203/0585 (Second resist used as mask for selective stripping of first resist) appears on 41 US grants and 21 published applications in this corpus.
Search patents in H05K- Granted patents
- 41
- Published applications
- 21
- Assignees
- 36
- Inventors
- 111
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 1 |
| 2003 | 3 | 2 |
| 2004 | 0 | 0 |
| 2005 | 2 | 0 |
| 2006 | 0 | 2 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 2 | 4 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 2 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 0 |
| 2021 | 1 | 0 |
| 2022 | 1 | 2 |
| 2023 | 0 | 1 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Apparatus and method for forming a resist fine pattern22 Jul 2025US 12,365,190 B2Unijet Co., Ltd.
- Package with substrate comprising variable thickness solder resist layer6 Sep 2022US 11,439,008 B2QUALCOMM Incorporated
- Direct patterning method for a touch panel and touch panel thereof31 Aug 2021US 11,106,130 B2TPK Touch Solutions Inc.
- Circuit board and method of forming same22 Sep 2020US 10,785,878 B2Honeywell Federal Manufacturing & Technologies, LLC
- Method of thin film adhesion pretreatment24 Sep 2019US 10,426,043 B2Honeywell Federal Manufacturing & Technologies, LLC
- Apparatus and method for forming a resist fine pattern15 Jun 2023US 2023/0182488 A1Unijet Co., Ltd.
- Method of producing printed circuit boards and printed circuit boards produced in accordance with the method10 Nov 2022US 2022/0361341 A1Gebr. Schmid GmbH & Co.
- Package with substrate comprising variable thickness solder resist layer17 Feb 2022US 2022/0053639 A1QUALCOMM Incorporated
- Direct patterning method for a touch panel and touch panel thereof5 Sep 2019US 2019/0271911 A1TPK Touch Solutions Inc.
- Circuit board and method of forming same5 Sep 2019US 2019/0274223 A1Honeywell Federal Manufacturing & Technologies, LLC
Most cited
By later US patents
- Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer92US 5,244,833 AInternational Business Machines Corporation · 1993
- Laminate for insulation protection of circuit boards66US 5,601,905 ANippon Steel Chemical Co., Ltd. · 1997
- Method of making an electrical multilayer copper interconnect54US 4,810,332 AMicroelectronics and Computer Technology Corporation · 1989
- Integrated circuit substrate with contacts thereon for a packaging structure39US 5,010,389 AInternational Business Machines Corporation · 1991
- Electrical interconnection substrate with both wire bond and solder contacts, and fabrication method31US 5,445,311 AHughes Aircraft Company · 1995