Package with substrate comprising variable thickness solder resist layer
AssigneeQUALCOMM Incorporated
InventorsKun FANG, Jaehyun YEON, Suhyung HWANG, Hyunchul CHO, Boyu TSENG
Life of this patent
Estimating the term…
Abstract
A package that includes a substrate and an electrical component coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, and a solder resist layer located over a surface of the at least one dielectric layer. The solder resist layer includes a first solder resist layer portion comprising a first thickness, and a second solder resist layer portion comprising a second thickness that is less than the first thickness. The electrical component is located over the second solder resist layer portion.
Claims25
A substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects located in the at least one dielectric layer;
- and
- a solder resist layer located over a surface of the at least one dielectric layer, wherein the solder resist layer comprises:
- a first solder resist layer portion comprising a first thickness;
- and
- a second solder resist layer portion comprising a second thickness that is less than the first thickness.
A package comprising:
- a substrate comprising:
- at least one dielectric layer;
- a plurality of interconnects located in the at least one dielectric layer;
- and
- a solder resist layer located over a surface of the at least one dielectric layer, wherein the solder resist layer comprises:
- a first solder resist layer portion comprising a first thickness;
- and
- a second solder resist layer portion comprising a second thickness that is less than the first thickness;
- and
- an electrical component coupled to the substrate, wherein the electrical component is located over the second solder resist layer portion.
A method for fabricating a substrate, comprising:
- forming at least one dielectric layer;
- forming a plurality of interconnects in the at least one dielectric layer;
- and
- forming a solder resist layer over a surface of the at least one dielectric layer, wherein forming the solder resist layer comprises:
- forming a first solder resist layer portion comprising a first thickness;
- and
- forming a second solder resist layer portion comprising a second thickness that is less than the first thickness.
Dependencies are inferred from the claim text.