Circuit board and method of forming same
AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorMichael Girardi
Life of this patent
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Abstract
A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.
Claims20
A method of thin film adhesion pretreatment, the method comprising the steps of:
- providing a substrate having a first surface, the substrate including glass phase particles and particles of at least one other material;
- ion milling the first surface of the substrate so as to preferentially remove some of the glass phase particles from the substrate such that most of the particles of the at least one other material are unremoved for improving the thin film adhesion.
A method of thin film adhesion pretreatment, the method comprising the steps of:
- providing a substrate having a first surface, the substrate including glass phase particles;
- ion milling the first surface of the substrate so as to preferentially remove some of the glass phase particles from the substrate for improving the thin film adhesion.
A method of thin film adhesion pretreatment, the method comprising the steps of:
- providing a substrate having a first surface, the substrate including SiO2 glass phase particles and particles of at least one other material;
- creating a vacuum around the substrate;
- and
- ion milling the first surface via accelerating a gas from a wide beam ion source into the first surface for between approximately ten minutes to approximately sixty minutes so that the gas preferentially removes some of the glass phase particles from the substrate such that most of the particles of the at least one other material are unremoved for improving the thin film adhesion.
Dependencies are inferred from the claim text.