Direct patterning method for a touch panel and touch panel thereof

A direct patterning method for a touch panel, the direct patterning method comprising:

• providing a substrate having a display region and a peripheral region;
• forming a periphery circuit on the peripheral region, wherein the periphery circuit comprises a bonding pad, and the periphery circuit comprises a single layer of silver or a single layer of copper or multilayer materials comprising molybdenum and aluminum;
• disposing a metal nanowire layer on the display region and the peripheral region, wherein the metal nanowire layer comprises a plurality of metal nanowires and is stacked on the bonding pad, and the metal nanowire layer is formed directly on the substrate on the display region, and the metal nanowire layer is formed on the substrate and covers the periphery circuit on the peripheral region;
• pre-curing a coated layer to form a pre-cured layer on the metal nanowire layer, wherein the pre-cured layer is photosensitive;
• performing a photolithography process, comprising:
• exposing the pre-cured layer to define a removal area and a reserved area;
• and
• removing the pre-cured layer and the metal nanowire layer on the removal area using a developer solution to form touch-sensing electrodes disposed on the display region and to expose the bonding pad disposed on the peripheral region, wherein the touch-sensing electrodes are electrically connected to the periphery circuit, and the touch-sensing electrodes include the pre-cured layer and the metal nanowire layer;
• and
• curing the pre-cured layer.