Method of thin film adhesion pretreatment
AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorMichael Girardi
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Abstract
A circuit board comprising a substrate and a circuit trace. The substrate includes a surface etched via ion milling over a circuit area such that the surface has an increased roughness. The circuit trace forms portions of an electronic circuit and may be created from a thin conductive film deposited on the surface within the circuit area. The circuit trace adheres more strongly to the roughened substrate surface, which prevents the circuit trace from peeling or becoming delaminated from the substrate surface.
Claims10
A method of thin film adhesion pretreatment, the method comprising the steps of:
- providing a substrate having a first surface, the substrate including SiO2 glass phase particles and particles of at least one other material;
- and
- preferentially removing some of the glass phase particles from the substrate via ion milling the first surface of the substrate so that most of the particles of the at least one other material are unremoved for improving the thin film adhesion.
A method of thin film adhesion pretreatment, the method comprising the steps of:
- providing a low temperature co-fired ceramic substrate having a first surface defining a circuit area, the substrate including SiO2 glass phase particles and alumina phase particles;
- creating a vacuum around the low temperature co-fired ceramic substrate;
- and
- preferentially removing between approximately 0.1 micrometers to approximately 5 micrometers of the SiO2 glass phase particles from the circuit area of the first surface of the substrate via ion milling the circuit area of the first surface of the substrate in the vacuum for between approximately ten minutes to approximately sixty minutes so that most of the alumina phase particles are unremoved for improving the thin film adhesion.
Dependencies are inferred from the claim text.