Method of making an electrical multilayer copper interconnect
AssigneeMicroelectronics and Computer Technology Corporation
InventorJu-Don T. Pan
Life of this patent
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Abstract
A method of making an electrical multilayer copper interconnect in which the electrical lines are protected by an electroplated overcoat. A plating interconnect is deposited on a substrate, a sacrificial layer of dielectric material is deposited on the plating interconnect. Thereafter a plating mask is formed on the dielectric material. Two self-aligned plating masks are patterned in one step, one of which is a plating mask for copper plating and the other is a plating mask for the overcoat. Preferably, before electroplating the overcoat, the copper is etched for exposing the sides adjacent the dielectric layer for allowing overcoating all of the copper.
Claims7
A method of making an electrical multilayer copper interconnect comprising,
- depositing a plating interconnect on a substrate,
- depositing a sacrificial layer of dielectric material on the plating interconnect,
- forming a plating mask on the dielectric material,
- etching away the dielectric material through the plating mask,
- plating a copper conductor into the etched away dielectric,
- stripping away the plating mask,
- forming a pillar plating mask on top of the conductor,
- plating a copper pillar onto the conductor,
- stripping the pillar plating mask,
- electroplating an overcoat layer on the exposed surface of the copper pillar and conductor, and
- stripping the sacrificial dielectric layer.
A method of making an electrical multilayer copper interconnect comprising,
- depositing a plating interconnect on a substrate,
- depositing a layer of polyimide on the plating interconnect,
- forming a conductor plating mask on the polyimide,
- patterning the conductor plating mask and the polyimide in a self-aligned pattern for a conductor,
- electroplating a copper conductor into the pattern and connected to the interconnect,
- stripping away the conductor plating mask,
- forming a pillar mask on top of the conductor,
- electroplating a copper pillar onto the conductor,
- stripping the pillar plating mask,
- etching away the copper sides adjacent the polyimide, and
- electroplating an overcoat layer on the exposed surface of the copper pillar and conductor,
- stripping the layer of polyimide away, and
- stripping the plating interconnect below the stripped polyimide.
Dependencies are inferred from the claim text.