H05K 2203/058
Additional resists used for the same purpose but in different areas, i.e.
Official title: Additional resists used for the same purpose but in different areas, i.e. not stacked
H05K2203/058 (Additional resists used for the same purpose but in different areas, i.e.) appears on 29 US grants and 39 published applications in this corpus.
Search patents in H05K- Granted patents
- 29
- Published applications
- 39
- Assignees
- 33
- Inventors
- 99
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 0 |
| 2004 | 1 | 3 |
| 2005 | 0 | 3 |
| 2006 | 3 | 2 |
| 2007 | 0 | 6 |
| 2008 | 1 | 3 |
| 2009 | 1 | 3 |
| 2010 | 0 | 1 |
| 2011 | 2 | 1 |
| 2012 | 2 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 3 |
| 2015 | 2 | 4 |
| 2016 | 3 | 0 |
| 2017 | 1 | 0 |
| 2018 | 1 | 2 |
| 2019 | 1 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 0 | 2 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Component carrier and method of manufacturing the same7 Apr 2026US 12,598,696 B2AT&S (Chongqing) Company Limited
- Apparatus and method for forming a resist fine pattern22 Jul 2025US 12,365,190 B2Unijet Co., Ltd.
- Solder resist layer structures for terminating de-featured components and methods of making the same19 May 2020US 10,658,198 B2Intel Corporation
- Solder resist layer structures for terminating de-featured components and methods of making the same26 Mar 2019US 10,244,632 B2Intel Corporation
- Circuit board and manufacturing method thereof15 May 2018US 9,974,166 B2Unimicron Technology Corp.
- Component Carrier and Method of Manufacturing the Same20 Mar 2025US 2025/0098060 A1AT&S (Chongqing) Company Limited
- Manufacturing a Component Carrier by a Nano Imprint Lithography Process14 Nov 2024US 2024/0381538 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Apparatus and method for forming a resist fine pattern15 Jun 2023US 2023/0182488 A1Unijet Co., Ltd.
- Method for producing wiring circuit board5 Jan 2023US 2023/0007783 A1Nitto Denko Corporation
- Method of manufacturing printed wiring board17 Nov 2022US 2022/0369469 A1Tanazawa Hakkosha Co., Ltd.
Most cited
By later US patents
- Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards75US 6,622,380 B1Micron Technology, Inc. · 2003
- Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate72US 7,098,407 B2Samsung Electronics Co., Ltd. · 2006
- Flexible printed wiring board and manufacturing method thereof44US 7,427,717 B2Matsushita Electric Industrial Co., Ltd. · 2008
- Tin and gold plating process29US 4,394,223 AThe United States of America as represented by the Secretary of the Air Force · 1983
- Method of making flexible printed circuits29US 4,411,982 AMatsushita Electric Industrial Co., Ltd. · 1983