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US 2025/0098060 A1Published application
Component Carrier and Method of Manufacturing the Same
AssigneeAT&S (Chongqing) Company Limited
InventorsLei Tang, Yung-lin Chia
Life of this patent
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Abstract
A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a solder resist structure on at least one of two opposing main surfaces of the stack. The solder resist structure includes at least two different kinds of solder resist provided on one of said main surfaces.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- and
- a solder resist structure on at least one of two opposing main surfaces of the stack;
- wherein the solder resist structure, comprising at least two different kinds of solder resist, is provided on one of said main surfaces.
1 more element
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- forming a solder resist structure on at least one of two opposing main surfaces of the stack;
- forming the solder resist structure on one of said main surfaces so as to comprise at least two different kinds of solder resist;
- and
- adjusting at least one dimension of the component carrier and/or adjusting a plurality of attributes of the solder resist structure for controlling at least one predefined property, for example warpage, of the component carrier.
2 more elements
Dependencies are inferred from the claim text.