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US 12,598,696 B2Granted
Component carrier and method of manufacturing the same
AssigneeAT&S (Chongqing) Company Limited
InventorsLei Tang, Yung-lin Chia
Life of this patent
Estimating the term…
Abstract
A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and a solder resist structure on at least one of two opposing main surfaces of the stack. The solder resist structure includes at least two different kinds of solder resist provided on one of said main surfaces.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a solder resist structure on at least one of two opposing main surfaces of the stack;
- wherein the solder resist structure, comprising at least two different kinds of solder resist, is provided on one of the two opposing main surfaces;
- and
- wherein the at least two different kinds of solder resist are at least two different solder resist materials or material compositions.
2 more elements
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- forming a solder resist structure on at least one of two opposing main surfaces of the stack;
- forming the solder resist structure on one of the opposing main surfaces with at least two different kinds of solder resist;
- and
- adjusting at least one dimension of the component carrier and/or adjusting a plurality of attributes of the solder resist structure for controlling at least one predefined property of the component carrier;
- wherein the at least two different kinds of solder resist are at least two different solder resist materials or material compositions.
3 more elements
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
- a solder resist structure on at least one of two opposing main surfaces of the stack;
- wherein the solder resist structure, comprising at least two different kinds of solder resist, is provided on one of the two opposing main surfaces;
- and
- wherein the at least two different kinds of solder resist differ concerning at least one of mechanical strength, coefficient of thermal expansion, Young modulus, and color.
2 more elements
Dependencies are inferred from the claim text.