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US 9,974,166 B2Granted
Circuit board and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsChun-Ting Lin, Tsung-Si Wang
Life of this patent
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Abstract
A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. The patterned circuit layer is disposed on the first surface, and a line width of the patterned circuit layer gradually reduces from the first surface towards the second surface. The photo-imaginable dielectric layer is disposed in the substrate corresponding to the patterned circuit layer. In addition, a manufacturing method of the circuit board is also proposed.
Claims9
A circuit board, comprising:
- a substrate, having a first surface and a second surface opposite to each other;
- a patterned circuit layer, embedded in the first surface, and a line width of the patterned circuit layer gradually reducing from the first surface towards the second surface;
- a patterned photo-imaginable dielectric layer, embedded in the substrate corresponding to the patterned circuit layer;
- and
- a first surface finish layer, exposed on the second surface and only covering a bottom surface of a part of the patterned circuit layer.
2 more elements
Dependencies are inferred from the claim text.