US 2023/0007783 A1Published application

Method for producing wiring circuit board

AssigneeNitto Denko Corporation

InventorsMasaki ITO, Hayato TAKAKURA, Kenya TAKIMOTO

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Abstract

A method for producing a wiring circuit board includes first forming a base insulating layer, and second forming a first wiring and a second wiring having different thicknesses from each other in order. The second step includes, in order, forming a seed film, forming a first resist in a reversed pattern of the first wiring on one surface in a thickness direction of the seed film, forming the first wiring on one surface in the thickness direction of the seed film by plating, removing the first resist, of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film to cover the first wiring, forming the second wiring on one surface in the thickness direction of the seed film by plating, removing the second resist, and removing the seed film.

Claims5

Dependent claims

A method for producing a wiring circuit board comprising:

a first step of forming an insulating layer, and
a second step of forming a first wiring and a second wiring having different thicknesses from each other in order on one surface in a thickness direction of the insulating layer, wherein
the second step includes, in order,
a step of forming a seed film on one surface in the thickness direction of the insulating layer,
a step of forming a first resist in a reversed pattern of the first wiring on one surface in the thickness direction of the seed film,
a step of forming the first wiring on one surface in the thickness direction of the seed film exposed from the first resist by plating,
a step of removing the first resist,
a step of forming a second resist in a reversed pattern of the second wiring on one surface in the thickness direction of the seed film so as to cover the first wiring,
a step of forming the second wiring on one surface in the thickness direction of the seed film exposed from the second resist by plating,
a step of removing the second resist, and
a step of removing the seed film exposed from the first wiring and the second wiring.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/783,206Filed 27 Nov 2020
Priority: JP 2019-22268010 Dec 2019
Published: 5 Jan 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 3/064
Etching masks: photoresists
H05K 3/108
In which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern: by semi-additive…
G03F 7/094
Characterised by structural details, e.g. supports, auxiliary layers: multilayer resist systems, e.g. planarising layers
H05K 2201/0338
Layered conductors or foils: layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer