Flexible printed wiring board and manufacturing method thereof
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsShinji Morimoto, Koji Nakashima, Toyokazu Yoshino, Katsuya Okamoto
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Abstract
A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.
Claims7
A flexible printed wiring board comprising:
- an insulative base film on which a conductor pattern is formed at least one surface thereof;
- a solder resist portion formed in a region including a component mounting portion of the conductor pattern in a predetermined pattern;
- and
- a cover lay film having an opening portion at a predetermined portion and and being provided above the conductor pattern,
- wherein the solder resist portion and the component mounting portion are apparent from the opening portion of the cover lay film.
A flexible printed wiring board manufactured by a method comprising:
- a conductor pattern forming process of forming a conductor pattern on at least one surface of an insulative base film;
- a solder resist forming process of then, forming a solder resist portion of a predetermined pattern, in a region including a component mounting portion of the conductor pattern, by a screen printing method;
- and
- a cover lay film pasting process of then, pasting a cover lay film having an opening portion at a predetermined portion, on the conductor pattern, in such a manner that an external circumference portion of the opening portion overlaps an upper portion of a peripheral portion of the solder portion,
- wherein the solder resist portion and the component mounting portion are apparent from the opening portion of the cover lay film.
Dependencies are inferred from the claim text.