H05K 2203/0591
Organic non-polymeric coating
Official title: Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
H05K2203/0591 (Organic non-polymeric coating) appears on 38 US grants and 18 published applications in this corpus.
Search patents in H05K- Granted patents
- 38
- Published applications
- 18
- Assignees
- 35
- Inventors
- 125
- Latest grant
- 21 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 4 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 2 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 2 | 2 |
| 2021 | 0 | 1 |
| 2022 | 0 | 3 |
| 2023 | 1 | 2 |
| 2024 | 2 | 0 |
| 2025 | 3 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board and semiconductor package using the same21 Oct 2025US 12,453,009 B2Samsung Electronics Co., Ltd.
- Circuit board and manufacturing method therefor18 Mar 2025US 12,256,500 B2Stemco Co., Ltd.
- Printed circuit board having a sacrificial pad to mitigate galvanic corrosion7 Jan 2025US 12,193,166 B2SanDisk Technologies LLC
- Systems for coating a substrate4 Jun 2024US 12,004,303 B2Nordson Corporation
- Etch barrier for microelectronic packaging conductive structures2 Apr 2024US 11,948,898 B2Intel Corporation
- Printed circuit board and semiconductor package using the same15 Jan 2026US 2026/0020153 A1Samsung Electronics Co., Ltd.
- Component carrier, method for manufacturing a component carrier and a package comprising a component carrier2 Oct 2025US 2025/0309013 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Printed circuit board having a sacrificial pad to mitigate galvanic corrosion19 Oct 2023US 2023/0337372 A1Western Digital Technologies, Inc.
- Printed circuit board and semiconductor package using the same26 Jan 2023US 2023/0027559 A1Samsung Electronics Co., Ltd.
- Circuit board and manufacturing method therefor8 Sep 2022US 2022/0287185 A1Stemco Co., Ltd.
Most cited
By later US patents
- Pre-plate cleaning process30US 5,077,176 AAT&T Bell Laboratories · 1991
- Making and using an ultra-thin copper foil29US 6,270,889 B1Mitsui Mining & Smelting Co., Ltd. · 2001
- Process for producing printed circuit board24US 5,028,513 AHitachi Chemical Company, Ltd. · 1991
- Method of forming solder film24US 5,556,023 AShowa Denko K. K. · 1996
- Organic-metallic composite coating for copper surface protection22US 5,960,251 AInternational Business Machines Corporation · 1999