Circuit board and manufacturing method therefor
AssigneeStemco Co., Ltd.
InventorsJin Han LEE, Sung Jin LEE, Jin Ho KIM
Life of this patent
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Abstract
A circuit board includes: a base substrate in which a protective layer formation region is defined; a wiring pattern which is formed on the base substrate and which has at least a portion formed in the protective layer formation region; a protective layer fixed onto the protective layer formation region and formed of a protective material; and a bleed prevention pattern formed on the base substrate so as to prevent the protective material from flowing beyond the protective layer formation region when the protective layer is formed.
Claims13
A circuit board comprising:
- a base substrate in which a protective layer formation region is defined;
- a wiring pattern which is formed on the base substrate and which has at least a portion formed in the protective layer formation region;
- a protective layer fixed onto the protective layer formation region and formed of a protective material;
- and
- a bleed prevention pattern formed on the base substrate so as to prevent the protective material from flowing beyond the protective layer formation region when the protective layer is formed.
A method for manufacturing a circuit board, comprising:
- preparing a base substrate in which a protective layer formation region is defined;
- forming on the base substrate a wiring pattern and a bleed prevention pattern that is applied to the protective layer formation region to prevent the protective material forming a protective layer from flowing beyond the protective layer formation region;
- and
- forming the protective layer by applying a protective material on the protective layer formation region.
Dependencies are inferred from the claim text.