H05K 2203/0582
Coating by resist, i.e. resist used as mask for application of insulating
Official title: Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
H05K2203/0582 (Coating by resist, i.e. resist used as mask for application of insulating) appears on 92 US grants and 70 published applications in this corpus.
Search patents in H05K- Granted patents
- 92
- Published applications
- 70
- Assignees
- 69
- Inventors
- 203
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 6 | 0 |
| 1989 | 4 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 5 | 1 |
| 2002 | 2 | 5 |
| 2003 | 2 | 4 |
| 2004 | 6 | 7 |
| 2005 | 3 | 4 |
| 2006 | 1 | 3 |
| 2007 | 3 | 2 |
| 2008 | 1 | 5 |
| 2009 | 1 | 5 |
| 2010 | 4 | 4 |
| 2011 | 5 | 1 |
| 2012 | 2 | 2 |
| 2013 | 2 | 1 |
| 2014 | 1 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 3 |
| 2018 | 2 | 2 |
| 2019 | 1 | 0 |
| 2020 | 2 | 1 |
| 2021 | 1 | 2 |
| 2022 | 1 | 3 |
| 2023 | 3 | 3 |
| 2024 | 1 | 6 |
| 2025 | 4 | 3 |
| 2026 | 0 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method for forming a resist fine pattern22 Jul 2025US 12,365,190 B2Unijet Co., Ltd.
- Pre-solder bump preventive overcoating15 Jul 2025US 12,361,966 B2Western Digital Technologies, Inc.
- Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object22 Apr 2025US 12,284,767 B2Fujikura Ltd.
- Methods for producing an etch resist pattern on a metallic surface8 Apr 2025US 12,270,111 B2Kateeva, Inc.
- Catalyzed metal foil and uses thereof16 Jan 2024US 11,877,404 B2Averatek Corporation
- Hybrid mold, method for manufacturing hybrid mold, wiring structure, and method for manufacturing wiring structure30 Apr 2026US 2026/0122788 A1Panasonic Intellectual Property Management Co., Ltd.
- Protection circuit module, method of manufacturing same and secondary battery including same26 Mar 2026US 2026/0088606 A1Samsung SDI.Co., Ltd.
- Methods for producing an etch resist pattern on a metallic surface19 Jun 2025US 2025/0198008 A1Kateeva, Inc.
- Wiring board and method for manufacturing wiring board5 Jun 2025US 2025/0185165 A1AOI Electronics Co., Ltd.
- Wiring substrate production method, wiring substrate, reticle, and exposure pattern-rendering data structure1 May 2025US 2025/0142731 A1Resonac Corporation
Most cited
By later US patents
- Method of making multilayer circuit103US 5,590,460 ATessera, Inc. · 1997
- Forming microelectronic connection components by electrophoretic deposition95US 6,492,201 B1Tessera, Inc. · 2002
- Laminate for insulation protection of circuit boards66US 5,601,905 ANippon Steel Chemical Co., Ltd. · 1997
- Process for manufacturing printed circuit employing selective provision of solderable coating50US 5,160,579 AMacDermid, Incorporated · 1992
- Apparatus and method for temporarily sealing holes in printed circuit boards39US 4,700,474 AMultitek, Inc. · 1987