Method of making multilayer circuit
AssigneeTessera, Inc.
InventorsThomas H. DiStefano, John W. Smith, Konstantine N. Karavakis, Zlata Kovac, Joseph Fjelstad
Life of this patent
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Abstract
An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.
Claims34
A method of making a multilayer circuit comprising the steps of:
- (a) stacking a circuit panel and an interposer so that a first surface of said interposer confronts a surface of said panel, said interposer having a body and conductors having ends adjacent a surface of the body and having a contact at each said conductor end, each said contact including a peripheral portion surrounding the associated conductor end, said peripheral portions of said contacts confronting pads on the circuit panel;
- and
- (b) compressing said stacked panel and interposer so as to forcibly engage said peripheral portions of said contacts with said contacts and expand the peripheral portion of each contact radially outwardly away from the associated conductor end so that each said peripheral portion moves horizontally with respect to the engaged pad and wipes the surface of the pad.
A method of making a circuit assembly comprising the steps of:
- (a) stacking a circuit panel and an interposer in vertically superposed arrangement so that a first horizontally-extensive surface of said interposer confronts a first horizontally-extensive surface of the circuit panel and so that a plurality of electrically conductive contacts on said first surface of said interposer confront pads on the circuit panel;
- (b) compressing said stacked panel and interposer vertically so as to forcibly engage said contacts with said pads and cause said contacts to deform so that at least a portion of each contact engaged with a pad moves horizontally with respect to the pad engaged pad and wipes the surface of the pad;
- and
- (c) bonding each said contact to the engaged contact.
A method of making a microelectronic interposer comprising the steps of:
- (a) providing a body defining a first surface;
- (b) providing a first temporary layer on said surface, said temporary layer having apertures therein;
- (c) depositing a layer of an electrically conductive structural material in each said aperture so that said structural material extends over the temporary layer to thereby form contacts;
- (d) connecting said contacts to conductors within said body;
- and
- (e) removing said temporary layer, leaving said contacts with outwardly flaring peripheral portions spaced vertically above said surface of said body.
A method of making a microelectronic interposer comprising the steps of:
- (a) providing a body having a first surface including a principal portion with open indentations therein, each said indentation having a central axis substantially normal to the principal portion of the surface and a wall substantially in the form of a surface of revolution flaring outwardly away from the central axis and merging with the principal portion of the surface, said body including a dielectric material defining said first surface;
- (b) depositing an electrically conductive structural material in said indentations to form a layer on said walls;
- and
- (c) controlling the horizontal extent of each said layer so that each said layer forms a plurality of tabs extending radially outwardly from the central axis.
Dependencies are inferred from the claim text.