Wiring substrate production method, wiring substrate, reticle, and exposure pattern-rendering data structure
AssigneeResonac Corporation
InventorsKei TOGASAKI, Kenichi IWASHITA, Kensuke YOSHIHARA, Masaya TOBA
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AssigneeResonac Corporation
InventorsKei TOGASAKI, Kenichi IWASHITA, Kensuke YOSHIHARA, Masaya TOBA
Estimating the term…
Provided is a method for manufacturing a wiring substrate. The method includes forming a resist layer on a support body, exposing the resist layer, developing the exposed resist layer to form an opening in the resist layer, forming a metal wiring in the opening, and removing the resist layer after the metal wiring is formed. In the exposing of the resist layer, a wiring exposure pattern that corresponds to the metal wiring, and a dummy exposure pattern that does not correspond to the metal wiring are exposed to the resist layer. At least a part of the dummy exposure pattern is located in a region within 200 μm from an end portion of the wiring exposure pattern.
A method for manufacturing a wiring substrate, comprising:
A wiring substrate, comprising:
A reticle for exposing a resist, comprising:
A non-transitory computer-readable storage medium storing an exposure drawing data structure for an exposure apparatus for exposing a resist layer, the exposure drawing data structure comprising:
Dependencies are inferred from the claim text.