Forming microelectronic connection components by electrophoretic deposition
AssigneeTessera, Inc.
InventorBelgacem Haba
Life of this patent
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Abstract
An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a further electrophoretic deposition process and further curing. Use of a second electrophoretic deposition step allows effective coating of parts having small holes without plugging the holes. The coated parts may be used as microelectronic connection components such as chip carriers used in packaging semiconductor chips.
Claims14
A method of making a microelectronic component comprising the steps of:
- (a) providing an electrically conductive element having oppositely-facing first and second major surfaces and openings extending through the element between said major surfaces;
- (b) depositing a first coating of uncured polymer by immersing the conductive element in a liquid bath containing an uncured polymer, contacting the bath with a counterelectrode and applying an electrical potential between the counterelectrode and conductive element so as to coat the element with uncured polymer by electrophoretic deposition;
- (c) removing the element from the bath and curing the uncured polymer on the element to form a dielectric coating;
- (d) depositing a second coating of uncured polymer by immersing the conductive element in a liquid bath containing an uncured polymer, contacting the bath with a counterelectrode and applying an electrical potential between the counterlectrode and conductive element so as to apply further uncured polymer by electrophoretic deposition;
- and
- (e) removing the element from the bath and curing said further polymer to provide additional dielectric material in said dielectric coating, wherein said dielectric coating, after step (e), does not occlude said openings but forms continuous dielectric liners extending through at least some of said openings.
Dependencies are inferred from the claim text.