H05K 2203/0577
Double layer of resist having the same pattern
H05K2203/0577 (Double layer of resist having the same pattern) appears on 156 US grants and 112 published applications in this corpus.
Search patents in H05K- Granted patents
- 156
- Published applications
- 112
- Assignees
- 93
- Inventors
- 364
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 0 | 1 |
| 2002 | 4 | 4 |
| 2003 | 7 | 10 |
| 2004 | 3 | 9 |
| 2005 | 8 | 8 |
| 2006 | 3 | 11 |
| 2007 | 10 | 12 |
| 2008 | 5 | 10 |
| 2009 | 6 | 7 |
| 2010 | 6 | 2 |
| 2011 | 8 | 4 |
| 2012 | 6 | 4 |
| 2013 | 1 | 1 |
| 2014 | 1 | 7 |
| 2015 | 3 | 2 |
| 2016 | 0 | 5 |
| 2017 | 6 | 3 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 3 |
| 2021 | 2 | 1 |
| 2022 | 2 | 1 |
| 2023 | 1 | 4 |
| 2024 | 3 | 0 |
| 2025 | 1 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Component carrier and method of manufacturing the same7 Apr 2026US 12,598,696 B2AT&S (Chongqing) Company Limited
- Printed circuit board and method for manufacturing the same14 Oct 2025US 12,446,163 B2Samsung Electro-Mechanics Co., Ltd.
- Method for manufacturing cured film, method for manufacturing electronic component, and electronic component3 Sep 2024US 12,077,677 B2Sekisui Chemical Co., Ltd.
- Printed circuit board and method for manufacturing the same25 Jun 2024US 12,022,621 B2Samsung Electro-Mechanics Co., Ltd.
- Method of manufacturing printed circuit board and resist laminate for the same19 Mar 2024US 11,937,378 B2Samsung Electro-Mechanics Co., Ltd.
- Ceramic substrate, light-emitting device, and methods of manufacturing ceramic substrate and light-emitting device30 Oct 2025US 2025/0338696 A1Nichia Corporation
- Component Carrier and Method of Manufacturing the Same20 Mar 2025US 2025/0098060 A1AT&S (Chongqing) Company Limited
- Printed circuit board and method for manufacturing the same19 Oct 2023US 2023/0337367 A1Samsung Electro-Mechanics Co., Ltd.
- Printed circuit board and method for manufacturing the same22 Jun 2023US 2023/0199975 A1Samsung Electro-Mechanics Co., Ltd.
- Method of manufacturing printed circuit board and resist laminate for the same23 Mar 2023US 2023/0086970 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components193US 4,067,104 ARockwell International Corporation · 1978
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Method for manufacturing a probe133US 5,513,430 AMotorola, Inc. · 1996
- Excimer laser patterning of a novel resist114US 4,780,177 AGeneral Electric Company · 1988
- Electroless deposition employing laser-patterned masking layer90US 4,865,873 AGeneral Electric Company · 1989