Method for manufacturing cured film, method for manufacturing electronic component, and electronic component

A method for producing a cured product film, comprising:

• an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device;
• a first light irradiation step in which, after the application step, the curable composition is irradiated with light from a first light irradiation part to allow the curing of the curable composition to proceed, thereby forming a precured product film;
• and
• a heating step in which, after the first light irradiation step, the precured product film irradiated with light is heated to cure the precured product film irradiated with light, thereby forming a cured product film,
• the ink jet device including:
• an ink tank to store the curable composition;
• a discharge part that is connected to the ink tank and discharges the curable composition;
• a circulation flow path part that is connected to the discharge part at one end and connected to the ink tank part at the other end, through which the curable composition flows;
• and
• a heating heater,
• the circulation flow path part including, in the circulation flow path part, a pump to transfer the curable composition and a buffer tank to temporarily store the curable composition,
• wherein the buffer tank is arranged between the pump and the discharge part and acts as a damper to suppress pressure fluctuation of the pump, and wherein a cross-sectional area of the buffer tank is greater than both a cross-sectional area of a portion of the circulation flow path part immediately upstream of the buffer tank and a cross-sectional area of a portion of the circulation flow path part immediately downstream of the buffer tank,
• the heating heater is introduced in the ink tank or is in the circulation flow path part, and
• the application step is such that, in the ink jet device, the curable composition is moved from the ink tank to the discharge part, and then the curable composition that has not been discharged from the discharge part is moved through the circulation flow path part to the ink tank, whereby the curable composition is applied while being circulated, and the temperature of the curable composition during circulation is 40° C. or more and 100° C. or less.