Method of manufacturing printed circuit board and resist laminate for the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChan Jin Park, Hyun Seok Yang
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Abstract
A method of manufacturing a printed circuit board a includes preparing an insulating substrate on which a first metal layer is formed, stacking a resist laminate having a plurality of layers on the first metal layer, forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers, forming a second metal layer on the exposed portion of the first metal layer, removing the patterned resist laminate having the plurality of layers, and etching at least another portion of the first metal layer.
Claims15
A method of manufacturing a printed circuit board, the method comprising:
- preparing an insulating substrate on which a first metal layer is formed;
- stacking a resist laminate having a plurality of layers on the first metal layer;
- forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers;
- forming a second metal layer on the exposed portion of the first metal layer;
- removing the patterned resist laminate having the plurality of layers;
- and
- etching at least another portion of the first metal layer.
A resist laminate comprising:
- a first resist layer of non-photosensitivity including an acrylic resin;
- and
- a photosensitive second resist layer disposed on the first resist layer.
Dependencies are inferred from the claim text.