Method of manufacturing printed circuit board and resist laminate for the same

A method of manufacturing a printed circuit board, the method comprising:

• preparing an insulating substrate on which a first metal layer is formed;
• stacking a resist laminate having a plurality of layers on the first metal layer;
• forming an opening exposing a portion of the first metal layer by patterning the stacked resist laminate having the plurality of layers;
• forming a second metal layer directly on the exposed portion of the first metal layer;
• removing the patterned resist laminate having the plurality of layers;
• and
• etching at least another portion of the first metal layer,
• wherein the resist laminate having the plurality of layers comprises a first resist layer of non-photosensitivity disposed directly on the first metal layer and a second resist layer of photosensitivity disposed on the first resist layer, and
• wherein the forming of the opening comprises:
• forming a second opening by exposing and developing, with a first development process, the second resist layer before the second metal layer is formed directly on the exposed portion of the first metal layer;
• and
• forming a first opening by developing, with a second development process after the first development process, the first resist layer, and
• wherein the forming of the second metal layer comprises filling the first and second openings with the second metal layer in a single step such that the second metal layer extends continuously from the first opening to the second opening.