H05K 2203/0571
Dual purpose resist
Official title: Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
H05K2203/0571 (Dual purpose resist) appears on 108 US grants and 81 published applications in this corpus.
Search patents in H05K- Granted patents
- 108
- Published applications
- 81
- Assignees
- 92
- Inventors
- 268
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 3 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 2 |
| 2003 | 3 | 3 |
| 2004 | 2 | 4 |
| 2005 | 2 | 3 |
| 2006 | 2 | 7 |
| 2007 | 2 | 5 |
| 2008 | 3 | 5 |
| 2009 | 4 | 5 |
| 2010 | 2 | 6 |
| 2011 | 3 | 4 |
| 2012 | 2 | 6 |
| 2013 | 6 | 3 |
| 2014 | 3 | 5 |
| 2015 | 3 | 7 |
| 2016 | 1 | 3 |
| 2017 | 3 | 2 |
| 2018 | 2 | 2 |
| 2019 | 2 | 2 |
| 2020 | 1 | 1 |
| 2021 | 1 | 0 |
| 2022 | 1 | 1 |
| 2023 | 0 | 2 |
| 2024 | 1 | 2 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Solder composition and method for manufacturing flexible circuit board28 Oct 2025US 12,454,030 B2Tamura Corporation
- Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same8 Apr 2025US 12,271,079 B2Dongwoo Fine-Chem Co., Ltd.
- Printed wiring board and method for manufacturing the same12 Mar 2024US 11,930,589 B2Ibiden Co., Ltd.
- Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other8 Feb 2022US 11,245,171 B2Murata Manufacturing Co., Ltd.
- Method of forming a solderable solder deposit on a contact pad8 Jun 2021US 11,032,914 B2Atotech Deutschland GmbH
- Manufacturing a Component Carrier by a Nano Imprint Lithography Process14 Nov 2024US 2024/0381538 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Method for producing wiring circuit board28 Mar 2024US 2024/0107667 A1Nitto Denko Corporation
- Solder composition and method for manufacturing flexible circuit board30 Mar 2023US 2023/0100601 A1Tamura Corporation
- Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same9 Feb 2023US 2023/0038765 A1Dongwoo Fine-Chem Co., Ltd.
- Printed wiring board and method for manufacturing the same10 Mar 2022US 2022/0078903 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Method of connecting electronic element to base plate81US 4,814,040 ASharp Kabushiki Kaisha · 1989
- Printed circuit board61US 4,221,925 AWestern Electric Company, Inc. · 1980
- Direct etch processes for the manufacture of high density multichip modules60US 5,509,553 ALitel Instruments · 1996