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US 4,814,040 AGranted
Method of connecting electronic element to base plate
AssigneeSharp Kabushiki Kaisha
InventorKazuhito Ozawa
Life of this patent
Estimating the term…
Abstract
An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.
Claims10
A method of connecting an electronic element to a base plate comprising the steps of
- forming a conductive pattern on said base plate and a conductive resist layer superposingly on said conductive pattern,
- placing a connecting means between said base plate and said electronic element, said connecting means comprising an adhesive layer having metallic particles dispersed therethrough, said metallic particles being larger than the layer thickness of said resist layer, and
- thermal compression of said base plate and said electronic element against each other with said connecting means sandwiched therebetween.
Dependencies are inferred from the claim text.