Direct etch processes for the manufacture of high density multichip modules

A process for the manufacture of multichip modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of:

• providing a substrate;
• coating the substrate with continuous blanket metal layer;
• directly patterning said metal layer to ablate said metal in a circuit pattern;
• coating the patterned metal with dielectric material;
• and
• patterning the dielectric material for forming vertical interconnects.

A process for the manufacture of multichip modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of:

• providing a substrate;
• coating the substrate with a blanket metal layer;
• coating the blanket metal layer with a blanket layer plating form;
• patterning said blanket layer plating form;
• plating up the exposed parts of the blanket metal layer;
• stripping the remaining plating form;
• etching back the plated up metal layer;
• coating the patterned metal with dielectric material;
• and,
• patterning the dielectric material for forming vertical interconnects.

A process for the manufacture of multichip modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of:

• providing a substrate;
• coating the substrate with metal;
• coating metal with etch block;
• patterning said etch block to expose said metal in a pattern for removal with remaining etch block overlying metallic traces in the required circuit pattern;
• etching the exposed metal to leave etch block overlying metallic traces in the required circuit pattern;
• and
• stripping the remaining etch block overlying the blocked metal traces of the required circuit pattern.

A process for the manufacture of multichip modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of:

• providing a substrate;
• coating the substrate with a metal layer;
• and
• directly patterning said metal layer to ablate said metal in a circuit pattern.

A process for the manufacture of multichip modules of the deposited variety having metallic traces in a required circuit pattern comprising the steps of:

• providing a substrate;
• coating the substrate with a metal layer;
• coating said metal layer with a blanket layer plating form;
• patterning said blanket layer plating form;
• plating up the exposed parts of the metal layer;
• stripping the remaining plating form;
• and
• etching back the plated up metal layer.