Circuit board for light-emitting diode assembly, backlight unit including the same and image display device including the same
AssigneeDongwoo Fine-Chem Co., Ltd.
InventorsCheol Hun Lee, Do Hyoung Kwon, Sung Jin Noh
Life of this patent
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Abstract
A circuit board for a light-emitting diode assembly according to an embodiment includes a substrate layer, dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads, and a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle including wirings connected to the LED landing pads at the same level.
Claims14
A circuit board for a light-emitting diode assembly, the circuit board comprising:
- a substrate layer;
- dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads;
- a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle comprising wirings connected to the LED landing pads at the same level;
- and
- an insulating layer formed on the substrate layer to cover the wiring bundle, the insulating layer including an opening partially exposing each of the LED landing pads,
- wherein a plurality of dimming zones neighboring in the column direction of the dimming zones to form a dimming zone column, and a plurality of the dimming zone columns are arranged in the row direction,
- wherein the wiring bundle comprise at least two common wirings commonly connected to a plurality of dimming zones among the dimming zones;
- and
- an individual wiring connected to each of the dimming zones,
- wherein a double-layered structure consisting of a single-layered conductive circuit layer including the LED landing pads and the wiring bundle, and a single-layered insulating layer is stacked on the one surface of the substrate layer,
- wherein the circuit board further comprises an intermediate layer formed between the conductive circuit layer and the substrate layer.
A circuit board for a light-emitting diode assembly, the circuit board comprising:
- a substrate layer;
- dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads;
- and
- a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle comprising wirings connected to the LED landing pads at the same level,
- wherein a plurality of dimming zones neighboring in the column direction of the dimming zones to form a dimming zone column, and a plurality of the dimming zone columns are arranged in the row direction,
- wherein the wiring bundle comprise at least two common wirings commonly connected to a plurality of dimming zones among the dimming zones;
- and
- an individual wiring connected to each of the dimming zones,
- wherein LED landing pads disposed at a lateral side in the row direction of the dimming zones have an area smaller than an area of LED landing pads which is not disposed at the lateral side.
Dependencies are inferred from the claim text.