H05K 2203/0574
Stacked resist layers used for different processes
H05K2203/0574 (Stacked resist layers used for different processes) appears on 121 US grants and 126 published applications in this corpus.
Search patents in H05K- Granted patents
- 121
- Published applications
- 126
- Assignees
- 80
- Inventors
- 356
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 2 |
| 2003 | 5 | 6 |
| 2004 | 2 | 6 |
| 2005 | 4 | 7 |
| 2006 | 6 | 14 |
| 2007 | 3 | 12 |
| 2008 | 10 | 11 |
| 2009 | 7 | 13 |
| 2010 | 6 | 6 |
| 2011 | 5 | 7 |
| 2012 | 10 | 9 |
| 2013 | 6 | 5 |
| 2014 | 3 | 3 |
| 2015 | 1 | 6 |
| 2016 | 2 | 3 |
| 2017 | 3 | 1 |
| 2018 | 1 | 0 |
| 2019 | 2 | 2 |
| 2020 | 2 | 2 |
| 2021 | 1 | 2 |
| 2022 | 2 | 3 |
| 2023 | 2 | 2 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device17 Feb 2026US 12,557,435 B2Innolux Corporation
- Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object22 Apr 2025US 12,284,767 B2Fujikura Ltd.
- Semiconductor package and manufacturing method thereof19 Dec 2023US 11,848,233 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for contacting and rewiring an electronic component embedded into a printed circuit board31 Jan 2023US 11,570,904 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Methods and processes for forming electrical circuitries on three-dimensional geometries12 Apr 2022US 11,304,303 B2Dujud LLC
- Electronic device21 May 2026US 2026/0143859 A1Innolux Corporation
- Method and electrical contact element23 Jan 2025US 2025/0031305 A1Rohde & Schwarz GmbH & Co.KG
- Printed circuit board and manufacturing method for the same16 May 2024US 2024/0164028 A1Samsung Electro-Mechanics Co., Ltd.
- Electronic device27 Apr 2023US 2023/0132292 A1Innolux Corporation
- Method for manufacturing wiring board, wiring board, method for manufacturing molded object, molded object5 Jan 2023US 2023/0007781 A1Fujikura Ltd.
Most cited
By later US patents
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991
- Trenching techniques for forming channels, vias and components in substrates116US 5,219,787 AMicroelectronics and Computer Technology Corporation · 1993
- Trenching techniques for forming vias and channels in multilayer electrical interconnects113US 5,091,339 AMicroelectronics and Computer Technology Corporation · 1992
- Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer92US 5,244,833 AInternational Business Machines Corporation · 1993