Method for contacting and rewiring an electronic component embedded into a printed circuit board

A printed circuit board comprising:

• a core material substrate;
• an electronic component having at least one contact element, wherein the electronic component is embedded within the core material substrate such that the at least one contact element is exposed on a contact surface of the core material substrate and configured to be substantially planar with respect to the contact surface of the core material substrate;
• a first dielectric layer disposed on the contact side of the core material substrate, wherein the first dielectric layer is structured such that it has a first exposure in the area of the at least one contact element, wherein the first exposure has a first width forming a first stepped transition between an outer surface of the first dielectric layer and the at least one contact element;
• and
• a second dielectric layer, wherein the second dielectric layer is structured such that it has a second exposure in the area of the at least one contact element, and wherein the second exposure has a second width that is wider than the first width such that second exposure forms a second stepped transition between the first and second dielectric layers and the at least one contact element.