H10W 90/751
Of bond wires
Official title: {of bond wires}
H10W90/751 (Of bond wires) appears on 38,961 US grants and 41,134 published applications in this corpus.
Search patents in H10W- Granted patents
- 38,961
- Published applications
- 41,134
- Assignees
- 4,234
- Inventors
- 44,104
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 28 | 0 |
| 1977 | 29 | 0 |
| 1978 | 30 | 0 |
| 1979 | 19 | 0 |
| 1980 | 18 | 0 |
| 1981 | 20 | 0 |
| 1982 | 23 | 0 |
| 1983 | 30 | 0 |
| 1984 | 37 | 0 |
| 1985 | 71 | 0 |
| 1986 | 57 | 0 |
| 1987 | 90 | 0 |
| 1988 | 89 | 0 |
| 1989 | 139 | 0 |
| 1990 | 150 | 0 |
| 1991 | 226 | 0 |
| 1992 | 249 | 0 |
| 1993 | 248 | 0 |
| 1994 | 331 | 0 |
| 1995 | 348 | 0 |
| 1996 | 375 | 0 |
| 1997 | 430 | 0 |
| 1998 | 618 | 0 |
| 1999 | 666 | 0 |
| 2000 | 733 | 0 |
| 2001 | 885 | 431 |
| 2002 | 942 | 1303 |
| 2003 | 1093 | 1293 |
| 2004 | 1141 | 1473 |
| 2005 | 1075 | 1712 |
| 2006 | 1085 | 1695 |
| 2007 | 1124 | 1888 |
| 2008 | 943 | 1986 |
| 2009 | 1080 | 1955 |
| 2010 | 1602 | 1913 |
| 2011 | 1693 | 2011 |
| 2012 | 1650 | 1979 |
| 2013 | 1773 | 1859 |
| 2014 | 1836 | 1922 |
| 2015 | 1882 | 1984 |
| 2016 | 1864 | 1807 |
| 2017 | 1805 | 1700 |
| 2018 | 1557 | 1547 |
| 2019 | 1560 | 1462 |
| 2020 | 1349 | 1541 |
| 2021 | 1151 | 1340 |
| 2022 | 1120 | 1491 |
| 2023 | 1052 | 1288 |
| 2024 | 1018 | 1440 |
| 2025 | 967 | 1184 |
| 2026 | 660 | 930 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 90/754Between a chip and a stacked insulating package substrate, interposer or rdl21,630
- H10W 90/756Between a chip and a stacked lead frame, conducting package substrate or16,816
- H10W 90/753Between laterally-adjacent chips5,140
- H10W 90/752Between stacked chips3,187
- H10W 90/755Between a chip and a laterally-adjacent insulating package substrate, interpose or rdl733
- H10W 90/759Between a chip and a laterally-adjacent discrete passive device393
- H10W 90/758Between a chip and a stacked discrete passive device95
- H10W 90/757Between a chip and a laterally-adjacent lead frame, conducting package substrate or3
Recent patents
- Semiconductor relay and electric circuit comprising same6 Oct 2026US 12,756,394 B2Panasonic Intellectual Property Management Co., Ltd.
- Semiconductor storage device6 Oct 2026US 12,757,341 B2Kioxia Corporation
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- H-bridge drive utilizing a pair of high and low side MOSFETs in a common insulation housing1,067US 6,747,300 B2Ternational Rectifier Corporation · 2004
- Polarless surface mounting light emitting diode1,041US 7,714,334 B22010
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004