H10W 90/753
Between laterally-adjacent chips
Official title: {between laterally-adjacent chips}
H10W90/753 (Between laterally-adjacent chips) appears on 5,140 US grants and 5,831 published applications in this corpus.
Search patents in H10W- Granted patents
- 5,140
- Published applications
- 5,831
- Assignees
- 1,151
- Inventors
- 8,478
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 4 | 0 |
| 1978 | 7 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 12 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 13 | 0 |
| 1990 | 8 | 0 |
| 1991 | 13 | 0 |
| 1992 | 13 | 0 |
| 1993 | 10 | 0 |
| 1994 | 30 | 0 |
| 1995 | 22 | 0 |
| 1996 | 21 | 0 |
| 1997 | 25 | 0 |
| 1998 | 44 | 0 |
| 1999 | 32 | 0 |
| 2000 | 50 | 0 |
| 2001 | 61 | 34 |
| 2002 | 61 | 111 |
| 2003 | 73 | 128 |
| 2004 | 101 | 117 |
| 2005 | 102 | 155 |
| 2006 | 110 | 163 |
| 2007 | 108 | 204 |
| 2008 | 104 | 202 |
| 2009 | 113 | 211 |
| 2010 | 194 | 271 |
| 2011 | 205 | 251 |
| 2012 | 206 | 293 |
| 2013 | 249 | 344 |
| 2014 | 282 | 393 |
| 2015 | 360 | 399 |
| 2016 | 342 | 344 |
| 2017 | 351 | 330 |
| 2018 | 311 | 252 |
| 2019 | 297 | 236 |
| 2020 | 223 | 265 |
| 2021 | 191 | 211 |
| 2022 | 195 | 249 |
| 2023 | 161 | 192 |
| 2024 | 140 | 190 |
| 2025 | 146 | 143 |
| 2026 | 102 | 143 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Power semiconductor package6 Oct 2026US 12,757,757 B2Pierburg GmbH
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Semiconductor system and wiring defect detecting method29 Sep 2026US 12,749,549 B2Kioxia Corporation
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor Device and Method of Making a Semiconductor Package with Graphene for Die Attach1 Oct 2026US 2026/0305028 A1STATS ChipPAC Pte. Ltd.
- Semiconductor device1 Oct 2026US 2026/0305417 A1Fuji Electric Co., Ltd.
- Multi-layer metal stack for wire bonding1 Oct 2026US 2026/0305453 A1
Most cited
By later US patents
- H-bridge drive utilizing a pair of high and low side MOSFETs in a common insulation housing1,067US 6,747,300 B2Ternational Rectifier Corporation · 2004
- Solid state white light emitter and display using same619US 6,600,175 B1Advanced Technology Materials, Inc. · 2003
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Semiconductor light emitting device integral type semiconductor light emitting unit image display unit and illuminating unit487US 7,002,182 B2Sony Corporation · 2006
- Semiconductor light-emitting device and semiconductor light-emitting device486US 7,087,932 B2Sony Corporation · 2006