Semiconductor relay and electric circuit comprising same

A semiconductor relay mounted on a circuit board, the semiconductor relay comprising:

• a first input terminal;
• a second input terminal;
• a light emitting element electrically connected to the first input terminal and the second input terminal;
• a light receiving element that receives light emitted from the light emitting element;
• a light-receiving drive element that includes the light receiving element and outputs a drive signal;
• a first MOSFET element that is turned on and off by the drive signal output from the light-receiving drive element;
• a second MOSFET element that is turned on and off by the drive signal output from the light-receiving drive element;
• a first output terminal including a first element placement part and a first output-side external terminal part;
• a second output terminal including a second element placement part and a second output-side external terminal part;
• and
• a sealing resin that seals the light emitting element, the light-receiving drive element, the first MOSFET element, the second MOSFET element, the first input terminal, the second input terminal, the first output terminal, and the second output terminal,
• wherein the light emitting element and the light receiving element face each other at a predetermined interval,
• each of the first MOSFET element and the second MOSFET element includes a first surface and a second surface facing the first surface,
• a direction in which the light receiving element and the light emitting element face each other is a same direction as a direction in which the first surface and the second surface face each other,
• the first surface of the first MOSFET element is placed on the first element placement part,
• the first surface of the second MOSFET element is placed on the second element placement part,
• the first element placement part extends in an up-down direction,
• the first output-side external terminal part extends from the first element placement part along a lower surface of the sealing resin and protrudes from the sealing resin, and
• the light-receiving drive element is placed on the second surface of the first MOSFET element and the second surface of the second MOSFET element.