H10W 90/757
Between a chip and a laterally-adjacent lead frame, conducting package substrate or
Official title: {between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}
H10W90/757 (Between a chip and a laterally-adjacent lead frame, conducting package substrate or) appears on 3 US grants and 32 published applications in this corpus.
Search patents in H10W- Granted patents
- 3
- Published applications
- 32
- Assignees
- 23
- Inventors
- 89
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 2 |
| 2025 | 0 | 1 |
| 2026 | 2 | 27 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing semiconductor apparatus and semiconductor apparatus8 Sep 2026US 12,733,511 B2Rohm Co., Ltd.
- Output matching network to reduce self and mutual inductances of output inductive components in a cavity package2 Jun 2026US 12,648,489 B2Sumitomo Electric Device Innovations, Inc.
- Rivetless lead fastening for a semiconductor package1 Oct 2019US 10,431,526 B2Cree, Inc.
- Semiconductor device17 Sep 2026US 2026/0282978 A1Mitsubishi Electric Corporation
- Semiconductor device20 Aug 2026US 2026/0248030 A1Kabushiki Kaisha Toshiba
- Semiconductor package having a die pad, a semiconductor transistor die and a layer structure having a ceramic layer23 Jul 2026US 2026/0215294 A1Infineon Technologies Austria AG
- Method of manufacturing semiconductor devices and corresponding semiconductor device23 Jul 2026US 2026/0215349 A1STMicroelectronics International N. V.
- Electronic device and method for manufacturing electronic device16 Jul 2026US 2026/0206614 A1Rohm Co., Ltd.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.