Rivetless lead fastening for a semiconductor package

A method of packaging a semiconductor device, comprising:

• providing a metal heat slug comprising an upper surface and lower surface;
• providing first and second electrically conductive leads;
• providing first and second non-metallic, electrically insulating fastening mechanisms;
• and
• adhering the first and second non-metallic, electrically insulating fastening mechanisms directly to the upper surface of the metal heat slug in an outer peripheral region of the metal heat slug such that the first and second electrically conductive leads are vertically separated from and electrically insulated from the metal heat slug,
• wherein the outer peripheral region surrounds a die attach region of the metal heat slug,
• wherein the die attach region is exposed from the first and second non-metallic, electrically insulating fastening mechanisms after adhering the first and second non-metallic, electrically insulating fastening mechanisms to the upper surface of the metal heat slug,
• wherein affixing the first and second electrically conductive leads to the metal heat slug using the first and second fastening mechanisms comprises affixing first and second discrete plastic columns on the upper surface of the metal heat slug, the first and second discrete plastic columns enveloping the first and second electrically conductive leads, respectively, and
• wherein an electrically insulating protective structure is formed around the first and second discrete plastic columns after affixing the first and second discrete plastic columns on the upper surface of the metal heat slug.

A semiconductor device package, comprising:

• a metal heat slug comprising an upper and lower surface;
• first and second electrically conductive leads;
• first and second non-metallic, electrically insulating fastening mechanisms that respectively affix the first and second electrically conductive leads to the metal heat slug such that the first and second electrically conductive leads are vertically separated from and electrically insulated from the metal heat slug;
• and
• an electrically insulating protective structure configured to enclose the semiconductor device package, the electrically insulating protective structure having outer walls aligned with an edge of an outer peripheral region of the metal heat slug,
• wherein the first and second non-metallic, electrically insulating fastening mechanisms are adhered directly to the upper surface of the metal heat slug in an outer peripheral region of the metal heat slug, the outer peripheral region surrounding a die attach region, and
• wherein the die attach region is uncovered from the first and second non-metallic, electrically insulating fastening mechanisms.

A semiconductor device package, comprising:

• a metal heat slug comprising an upper and lower surface;
• first and second electrically conductive leads;
• and
• first and second non-metallic, electrically insulating fastening mechanisms that respectively affix the first and second electrically conductive leads to the metal heat slug such that the first and second electrically conductive leads are vertically separated from and electrically insulated from the metal heat slug,
• wherein the first and second non-metallic, electrically insulating fastening mechanisms are adhered directly to the upper surface of the metal heat slug in an outer peripheral region of the metal heat slug, the outer peripheral region surrounding a die attach region,
• wherein the die attach region is uncovered from the first and second non-metallic, electrically insulating fastening mechanisms,
• wherein the metal heat slug comprises:
• first and second outer edge sides that are opposite from one another, a first protrusion that extends away from the first outer edge side, and a second protrusion that extends away from the second outer edge side, wherein the first non-metallic, electrically insulating fastening mechanism is disposed on the first protrusion, and wherein the second non-metallic, electrically insulating fastening mechanism is disposed on the second protrusion, and
• wherein outer walls of a protective structure and outer ends of the first and second protrusions are coextensive with one another.