H10W 90/752
Between stacked chips
Official title: {between stacked chips}
H10W90/752 (Between stacked chips) appears on 3,187 US grants and 4,161 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,187
- Published applications
- 4,161
- Assignees
- 576
- Inventors
- 5,253
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 7 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 14 | 9 |
| 2002 | 20 | 43 |
| 2003 | 28 | 49 |
| 2004 | 33 | 67 |
| 2005 | 49 | 69 |
| 2006 | 55 | 125 |
| 2007 | 71 | 123 |
| 2008 | 61 | 141 |
| 2009 | 66 | 134 |
| 2010 | 117 | 142 |
| 2011 | 142 | 149 |
| 2012 | 126 | 172 |
| 2013 | 159 | 200 |
| 2014 | 174 | 178 |
| 2015 | 192 | 187 |
| 2016 | 178 | 163 |
| 2017 | 169 | 167 |
| 2018 | 148 | 160 |
| 2019 | 161 | 173 |
| 2020 | 147 | 196 |
| 2021 | 143 | 192 |
| 2022 | 177 | 256 |
| 2023 | 200 | 274 |
| 2024 | 181 | 294 |
| 2025 | 184 | 291 |
| 2026 | 142 | 207 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Semiconductor device and electronic system including the same6 Oct 2026US 12,757,720 B2Samsung Electronics Co., Ltd.
- Wiring board, semiconductor device, and method for manufacturing semiconductor device6 Oct 2026US 12,757,762 B2Kioxia Corporation
- Encapsulating semiconductor chips using masks6 Oct 2026US 12,757,793 B2Kioxia Corporation
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Semiconductor storage device8 Oct 2026US 2026/0313798 A1Kioxia Corporation
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
- Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods8 Oct 2026US 2026/0314488 A1Micron Technology, Inc.
- Semiconductor devices, assemblies, and associated methods8 Oct 2026US 2026/0314491 A1Micron Technology, Inc.
Most cited
By later US patents
- Separation of thin films from transparent substrates by selective optical processing783US 6,071,795 AThe Regents of the University of California · 2000
- Semiconductor device475US 6,316,838 B1Fujitsu Limited · 2001
- Stack of IC chips in lieu of single IC chip394US 5,581,498 AIrvine Sensors Corporation · 1996
- Stacked package structure347US 7,242,081 B1Advanced Semiconductor Engineering, Inc. · 2007
- Stacked multi-chip modules and method of manufacturing346US 5,422,435 ANational Semiconductor Corporation · 1995