Semiconductor devices, assemblies, and associated methods
AssigneeMicron Technology, Inc.
InventorRaj K. Bansal
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly can include an assembly substrate having a top surface with a die stack thereat. The die stack can include a first and a second die, and each dies can include a die substrate with a top and a bottom surface. The top surface can include a first region a first distance from the bottom surface, and a second region a second distance, greater than the first distance, from the bottom surface and with a bond pad thereat. The bottom surface of the first die can bond with the top surface of the assembly substrate, and the bottom surface of the second die can bond with the first region of the first die top surface. In some embodiments, the assembly can further include additional die stacks and/or additional dies within one or more die stacks.
Claims20
A method of manufacturing a semiconductor device assembly, comprising:
- forming a plurality of semiconductor dies, by:
- forming a preliminary semiconductor die with a top surface and a bottom surface, the top surface having a first area adjacent to a second area, and
- forming, using the preliminary semiconductor die, a finalized semiconductor die with a redistribution layer over and extending from the second area and exclusive of the first area, the redistribution layer including a bond pad vertically spaced from the second area,
- wherein each of the plurality of semiconductor dies is one of the finalized semiconductor dies and has a top surface with a first region at the first area and a second region above the second area;
- bonding the bottom surface of a first one of the plurality of semiconductor dies to a semiconductor device assembly substrate;
- and
- bonding the bottom surface of a second one of the plurality of semiconductor dies to the first region of the top surface of the first one of the plurality of semiconductor dies.
The method of claim 1, wherein bonding the second one of the plurality of semiconductor dies to the first one of the plurality of semiconductor dies further includes the second region of the top surface of the first one of the plurality of semiconductor dies vertically spaced above the bottom surface of the second one of the plurality of semiconductor dies.
A method of manufacturing a semiconductor die, comprising:
- forming a preliminary semiconductor die including a die substrate with a top surface and a bottom surface, the top surface having a first area adjacent to a second area at a peripheral side edge of the preliminary semiconductor die;
- forming an active component in the die substrate beneath a plane of the first area;
- and
- forming a redistribution layer over and extending from the second area and exclusive of the first area, the redistribution layer including a bond pad vertically spaced from the second area and a conductive structure extending from and directly electrically connecting the bond pad to the active component,
- wherein the semiconductor die has a top surface with a first region at the first area and a second region above the second area, the second region extending along the peripheral side edge of the semiconductor die.
A method of assembling a semiconductor device assembly, comprising:
- bonding a bottom surface of a first semiconductor die to a top surface of an assembly substrate, the first semiconductor die having a first raised portion at a peripheral side edge of the first semiconductor die and a first bond pad formed on the first raised portion;
- bonding a bottom surface of a second semiconductor die to a first region of an upper surface of the first semiconductor die, the second semiconductor die having a second raised portion at a peripheral side edge of the second semiconductor die with a second bond pad formed on the second raised portion, wherein the second raised portion of the second semiconductor die is spaded laterally apart from the first raised portion of the first semiconductor die;
- and
- forming a wire bond between the first bond pad and the second bond pad.
Dependencies are inferred from the claim text.