H10W 90/756
Between a chip and a stacked lead frame, conducting package substrate or
Official title: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
H10W90/756 (Between a chip and a stacked lead frame, conducting package substrate or) appears on 16,816 US grants and 16,505 published applications in this corpus.
Search patents in H10W- Granted patents
- 16,816
- Published applications
- 16,505
- Assignees
- 2,233
- Inventors
- 20,529
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 21 | 0 |
| 1978 | 16 | 0 |
| 1979 | 11 | 0 |
| 1980 | 11 | 0 |
| 1981 | 12 | 0 |
| 1982 | 8 | 0 |
| 1983 | 11 | 0 |
| 1984 | 21 | 0 |
| 1985 | 34 | 0 |
| 1986 | 30 | 0 |
| 1987 | 47 | 0 |
| 1988 | 51 | 0 |
| 1989 | 73 | 0 |
| 1990 | 81 | 0 |
| 1991 | 135 | 0 |
| 1992 | 160 | 0 |
| 1993 | 157 | 0 |
| 1994 | 199 | 0 |
| 1995 | 212 | 0 |
| 1996 | 227 | 0 |
| 1997 | 219 | 0 |
| 1998 | 320 | 0 |
| 1999 | 351 | 0 |
| 2000 | 360 | 0 |
| 2001 | 448 | 217 |
| 2002 | 437 | 625 |
| 2003 | 521 | 581 |
| 2004 | 526 | 613 |
| 2005 | 475 | 766 |
| 2006 | 475 | 753 |
| 2007 | 487 | 823 |
| 2008 | 419 | 873 |
| 2009 | 479 | 866 |
| 2010 | 706 | 823 |
| 2011 | 725 | 931 |
| 2012 | 727 | 898 |
| 2013 | 809 | 797 |
| 2014 | 841 | 840 |
| 2015 | 823 | 837 |
| 2016 | 809 | 766 |
| 2017 | 766 | 686 |
| 2018 | 630 | 597 |
| 2019 | 585 | 540 |
| 2020 | 519 | 518 |
| 2021 | 407 | 439 |
| 2022 | 359 | 479 |
| 2023 | 314 | 372 |
| 2024 | 320 | 317 |
| 2025 | 256 | 310 |
| 2026 | 172 | 238 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Package with low-warpage carrier6 Oct 2026US 12,757,756 B2Infineon Technologies AG
- Semiconductor device6 Oct 2026US 12,757,766 B2Rohm Co., Ltd.
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device8 Oct 2026US 2026/0314463 A1Kabushiki Kaisha Toshiba
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Optoelectronic element with a non-protruding lens988US 7,067,893 B2Masimo Corporation · 2006
- Illuminator assembly incorporating light emitting diodes881US 5,803,579 AGentex Corporation · 1998