H10W 90/758
Between a chip and a stacked discrete passive device
Official title: {between a chip and a stacked discrete passive device}
H10W90/758 (Between a chip and a stacked discrete passive device) appears on 95 US grants and 105 published applications in this corpus.
Search patents in H10W- Granted patents
- 95
- Published applications
- 105
- Assignees
- 61
- Inventors
- 211
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 4 |
| 2003 | 1 | 2 |
| 2004 | 3 | 3 |
| 2005 | 3 | 4 |
| 2006 | 6 | 2 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 1 |
| 2012 | 2 | 6 |
| 2013 | 4 | 4 |
| 2014 | 7 | 11 |
| 2015 | 6 | 4 |
| 2016 | 7 | 6 |
| 2017 | 7 | 8 |
| 2018 | 9 | 6 |
| 2019 | 8 | 1 |
| 2020 | 3 | 9 |
| 2021 | 3 | 5 |
| 2022 | 7 | 6 |
| 2023 | 3 | 4 |
| 2024 | 3 | 7 |
| 2025 | 4 | 2 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Substrate-on-die package architecture4 Aug 2026US 12,702,021 B2Texas Instruments Incorporated
- Semiconductor device28 Jul 2026US 12,696,767 B2Sumitomo Electric Device Innovations, Inc.
- Semiconductor module9 Sep 2025US 12,412,813 B2Mitsubishi Electric Corporation
- Semiconductor package and memory device including the same9 Sep 2025US 12,412,849 B2Samsung Electronics Co., Ltd.
- Mounting crystal resonator over inductor in an integrated circuit package17 Sep 2026US 2026/0283010 A1Microchip Technology Incorporated
- Package-integrated lead frame antennas6 Aug 2026US 2026/0231783 A1
- Microelectronic device package with integrated trench capacitor dies and semiconductor device die6 Aug 2026US 2026/0231818 A1Texas Instruments Incorporated
- Semiconductor device14 May 2026US 2026/0136648 A1Sumitomo Electric Industries, Ltd.
- Multi-die isolated lead frame package7 Aug 2025US 2025/0253213 A1Allegro MicroSystems, LLC
Most cited
By later US patents
- Integrated circuit package including miniature antenna102US 7,095,372 B2Fractus, S. A. · 2006
- Non-contact IC card and process for its production99US 5,705,852 ASony Chemicals Corp. · 1998
- Flex circuit package and method37US 8,536,462 B1Amkor Technology, Inc. · 2013
- Vertically integrated systems28US 8,853,799 B2Analog Devices, Inc. · 2014
- Vertically integrated systems25US 8,569,861 B2Analog Devices, Inc. · 2013