Flex circuit package and method

A flex circuit package comprising:

• an electronic component mounted to a first surface of a substrate;
• first traces on the first surface of the substrate, the first traces being electrically connected to the electronic component;
• a package body enclosing the electronic component and the first surface of the substrate;
• and
• interconnection ball stacks physically and electrically connected to the first traces, the interconnection ball stacks comprising non-collapsing material extending through the package body, the interconnection ball stacks comprising at least three interconnection balls stacked one upon another.

A flex circuit package comprising:

• an electronic component mounted to a first surface of a substrate;
• first traces on the first surface of the substrate, the first traces being electrically connected to the electronic component;
• a package body enclosing the electronic component and the first surface of the substrate;
• and
• columns physically and electrically connected to the first traces, the columns comprising non-collapsing material extending through the package body, the columns comprising:
• spherical portions enclosed within the packaged body;
• and
• necks between the spherical portions, the necks having a smaller diameter than the spherical portions.