Vertically integrated systems
AssigneeAnalog Devices, Inc.
InventorsAlan O'Donnell, Santiago Iriarte, Mark J. Murphy, Colin Lyden, Gary Casey, Eoin Edward English
Life of this patent
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Abstract
Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
Claims103
An integrated circuit system, comprising:
- a first active layer fabricated on a front side of a semiconductor die;
- a second pre-fabricated layer on a back side of the semiconductor die and having electrical components and one or more links connecting the electrical components embodied therein, wherein the electrical components include at least one discrete passive component;
- and
- at least one electrical path coupling the first active layer and the second pre-fabricated layer,
- wherein the one or more links are modifiable to tune performance of the integrated circuit system after assembly of the first active layer with the second pre-fabricated layer.
An electronic device comprising:
- a circuit board;
- and
- a vertically integrated circuit disposed on the circuit board comprising:
- a first active layer fabricated on a front side of a semiconductor die;
- a second pre-fabricated layer on a back side of the semiconductor die and having electrical components and one or more links connecting the electrical components embodied therein, wherein the electrical components include at least one discrete passive component;
- and
- at least one electrical path coupling the first active layer and the second pre-fabricated layer,
- wherein the one or more links are modifiable to tune performance of the integrated circuit system after assembly of the first active layer with the second pre-fabricated layer.
A vertically integrated circuit, comprising:
- an active layer having an active circuit;
- and
- a component layer disposed on a back side of the active layer, and having a plurality of discrete passive components and links,
- wherein at least one link is a fuse, and
- wherein the discrete passive components are electrically connected to the active circuit.
Dependencies are inferred from the claim text.