Vertically integrated systems
AssigneeAnalog Devices, Inc.
InventorsAlan J. O'Donnell, Santiago Iriarte, Mark J. Murphy, Colin G. Lyden, Gary Casey, Eoin Edward English
Life of this patent
Estimating the term…
Abstract
Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
Claims33
An integrated circuit system, comprising:
- an active layer fabricated on a front side of a semiconductor die;
- an energy harvesting layer on a back side of the semiconductor die, the energy harvesting layer configured to convert a non-electrical form of energy into charge;
- and
- at least one electrical path configured to distribute the charge to supply power to a component in the integrated circuit system.
A method, comprising:
- converting a non-electrical form of energy into charge in a first layer disposed on a back side of a semiconductor die;
- and
- distributing the charge to an active component fabricated on a front side of the semiconductor die to supply power to the active component.
A device, comprising:
- a circuit board;
- and
- a vertically integrated circuit on the circuit board, comprising:
- an active layer fabricated on a front side of a semiconductor die,
- an energy harvesting layer on a back side of the semiconductor die configured to convert energy into charge in response to a non-electrical environmental condition, and
- at least one electrical path configured to distribute the charge in the vertically integrated circuit.
An integrated circuit system, comprising:
- a semiconductor die comprising an active layer;
- an energy harvesting layer vertically integrated with the semiconductor die, the energy harvesting layer configured to receive a non-electrical form of energy and convert the non-electrical form of energy into electrical energy;
- an electrical storage component integrated with the energy harvesting layer, the electrical storage component configured to store the electrical energy;
- and
- at least one electrical path configured to distribute the stored electrical energy from the electrical storage component to another component in the integrated circuit system.
A method, comprising:
- responsive to an environmental condition, converting a non-electrical form of energy into an electrical form of energy in an energy harvesting layer that is vertically integrated with a semiconductor die having an active layer;
- storing charge associated with the electrical form of energy from the energy harvesting layer to an electrical storage component integrated with the energy harvesting layer;
- and
- distributing the stored charge from the electrical storage component to an active component of an integrated circuit system that includes the energy harvesting layer and the semiconductor die.
Dependencies are inferred from the claim text.