Semiconductor package and memory device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorHyunjin Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes: a package board including a plurality of connection pads; a semiconductor chip including a first surface and a plurality of bonding pads, wherein the first surface of the semiconductor chip contacts a first surface of the package board, and wherein the plurality of bonding pads are respectively connected to the plurality of connection pads; and a thermal fuse circuit connected between a sensing connection pad of the plurality of connection pads and a sensing bonding pad of the plurality of bonding pads, and configured to open between the sensing connection pad and the sensing bonding pad when an internal temperature of the thermal fuse circuit is greater than or equal to a cutoff temperature of the thermal fuse circuit.
Claims20
A semiconductor package comprising:
- a package board including a plurality of connection pads;
- a semiconductor chip including a first surface and a plurality of bonding pads, wherein the first surface of the semiconductor chip contacts a first surface of the package board, and wherein the plurality of bonding pads are respectively connected to the plurality of connection pads;
- and
- a thermal fuse circuit connected between a sensing connection pad of the plurality of connection pads and a sensing bonding pad of the plurality of bonding pads, and configured to open between the sensing connection pad and the sensing bonding pad when an internal temperature of the thermal fuse circuit is greater than or equal to a cutoff temperature of the thermal fuse circuit.
A semiconductor package comprising:
- a package board including a plurality of connection pads;
- a first semiconductor chip including a first surface and a plurality of first bonding pads, wherein the first surface of the first semiconductor chip is in contact with a first surface of the package board;
- a second semiconductor chip including a first surface and a plurality of second bonding pads, wherein the first surface of the second semiconductor chip is in contact with a second surface of the first semiconductor chip, and wherein the plurality of second bonding pads are connected to the plurality of connection pads and the plurality of first bonding pads;
- and
- a thermal fuse circuit connected between a sensing connection pad of the plurality of connection pads and a second sensing bonding pad of the plurality of second bonding pads, and configured to open between the sensing connection pad and the second sensing bonding pad when an internal temperature of the thermal fuse circuit is greater than or equal to a cutoff temperature of the thermal fuse circuit.
A memory device comprising:
- a circuit board comprising a plurality of connection pins;
- a package board including a plurality of connection pads to be connected to the plurality of connection pins through a plurality of solder balls;
- a semiconductor chip including a first surface and a plurality of bonding pads, wherein the first surface of the semiconductor chip is in contact with a first surface of the package board, and wherein the plurality of bonding pads are connected to the plurality of connection pads;
- and
- a thermal fuse circuit connected to a sensing connection pad of the plurality of connection pads and a sensing bonding pad of the plurality of bonding pads, and configured to open between the sensing connection pad and the sensing bonding pad when an internal temperature of the thermal fuse circuit is greater than or equal to a cutoff temperature of the thermal fuse circuit.
Dependencies are inferred from the claim text.