Semiconductor module
AssigneeMitsubishi Electric Corporation
InventorKensuke Takeuchi
Life of this patent
Estimating the term…
Abstract
The present disclosure includes: a base plate having a shape of a sheet; a relay plate having a shape of a sheet; a terminal member; and an electronic component joined to one surface of the base plate. The base plate, the relay plate, and the terminal member are electrically conductive members and arranged on a same plane with gaps between the electrically conductive members. The electronic component and one surface of the relay plate are connected to each other by a bonding wire. The one surface of the relay plate and one surface of the terminal member are connected to each other by a bonding wire.
Claims9
A semiconductor module comprising:
- a base plate having a shape of a sheet;
- a relay plate having a shape of a sheet;
- a terminal member;
- an electronic component joined to one surface of the base plate;
- and
- a mold resin sealing the base plate, the relay plate, the terminal member, the electronic component, and bonding wire, wherein
- the base plate, the relay plate, and the terminal member are electrically conductive members and arranged as a same plane with gaps between the electrically conductive members,
- the electronic component and one surface of the relay plate are connected to each other by a first bonding wire,
- the one surface of the relay plate and one surface of the terminal member are connected to each other by a second bonding wire,
- the relay plate has a shape of a rectangular sheet,
- if a direction parallel to a long side of the relay plate is defined as a long side direction, each bonding wire is connected to a one-side portion or an other-side portion in the long side direction of the relay plate,
- the mold resin is formed in an external shape that is a shape of a rectangular sheet having a sheet surface parallel to the same plane, and
- the relay plate is disposed such that one long side thereof extends along a side surface of the mold resin.
Means for preventing wire sag and wire sweep in a semiconductor module, comprising:
- a base plate, a relay plate, and a terminal member being electrically conductive members and arranged as a same plane with gaps between the electrically conductive members;
- a first bonding wire connecting the electronic component and one surface of the relay plate, and a second bonding wire connecting the terminal member and the one surface of the relay plate;
- and
- a mold resin sealing the base plate, the relay plate, the terminal member, the electronic component, the first bonding wire, and the second bonding wire, wherein
- the relay plate has a shape of a rectangular sheet,
- if a direction parallel to a long side of the relay plate is defined as a long side direction, each bonding wire is connected to a one-side portion or an other-side portion in the long side direction of the relay plate,
- the mold resin is formed in an external shape that is a shape of a rectangular sheet having a sheet surface parallel to the same plane, and
- the relay plate is disposed such that one long side thereof extends along a side surface of the mold resin.
Dependencies are inferred from the claim text.