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US 2026/0283010 A1Published application
Mounting crystal resonator over inductor in an integrated circuit package
AssigneeMicrochip Technology Incorporated
InventorsSlobodan Milijevic, John Kirby, Isabella Ikadara, Denis Verreault, Abbas Tariq
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Abstract
Some examples of the teachings herein include a system comprising: a silicon die including an inductor element; a crystal connected to the silicon die by bonding wires; and a non-conductive spacer between the silicon die and the crystal; wherein the non-conductive spacer has a thickness defining a distance between the silicon die and the crystal, the distance selected to reduce an effect of the crystal on a magnetic flux of the inductor.
Claims12
A system comprising:
- a silicon die including an inductor element;
- a crystal connected to the silicon die by bonding wires;
- and
- a non-conductive spacer between the silicon die and the crystal;
- wherein the non-conductive spacer has a thickness defining a distance between the silicon die and the crystal, the distance selected to reduce an effect of the crystal on a magnetic flux of the inductor element.
2 more elements
An integrated circuit package comprising:
- a silicon die including an inductor element;
- a non-conductive spacer with a first side attached to the silicon die above the inductor element;
- a crystal attached to a second side of the non-conductive spacer opposite the first side;
- bonding wires connecting the crystal to the silicon die;
- and
- an encapsulation surrounding the crystal and the non-conductive spacer;
- wherein the non-conductive spacer has a thickness between the silicon die and the crystal, the thickness selected to reduce an effect of the crystal on a magnetic flux of the inductor element.
4 more elements
Dependencies are inferred from the claim text.