Non-contact IC card and process for its production
AssigneeSony Chemicals Corp.
InventorsKatsuhisa Orihara, Masahiro Fujimoto, Haruo Monkawa, Hideyuki Kurita
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Abstract
In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding.
Claims7
A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising:
- a substrate having at least an IC chip and an antenna coil formed by etching;
- wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer;
- the IC chip being formed across the antenna coil;
- wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.
A non-contact IC card that transfers information through an induction electromagnetic field serving as a transmission medium comprising:
- a substrate having at least an IC chip and an antenna coil formed by etching, wherein a connecting terminal of said antenna coil and a connecting bump of said IC chip are directly interconnected by wire bonding,
- the IC chip being formed across the antenna coil,
- wherein at least part of said antenna coil is decreased in width so that a distance between the connecting terminal on an inner peripheral side and the connecting terminal on an outer peripheral side of said antenna coil is substantially the same as a distance between the connecting bumps of said IC chip which are connected with the terminals.
A process for producing a non-contact IC card, comprising the steps of;
- forming a resist layer having at least an antenna coil pattern, on a conductive layer provided on an insulating substrate;
- etching the conductive layer, using the resist layer as a mask, to form at least an antenna coil and a connecting terminal thereof;
- forming an anisotropic conductive adhesive layer on the connecting terminal of the antenna coil;
- and
- interconnecting the connecting terminal of the antenna coil and a connecting bump of an IC chip in a face-down fashion via the anisotropic conductive adhesive layer.
Dependencies are inferred from the claim text.