H10W 90/759
Between a chip and a laterally-adjacent discrete passive device
Official title: {between a chip and a laterally-adjacent discrete passive device}
H10W90/759 (Between a chip and a laterally-adjacent discrete passive device) appears on 393 US grants and 444 published applications in this corpus.
Search patents in H10W- Granted patents
- 393
- Published applications
- 444
- Assignees
- 170
- Inventors
- 872
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 2 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 3 |
| 2002 | 6 | 6 |
| 2003 | 6 | 4 |
| 2004 | 8 | 8 |
| 2005 | 2 | 11 |
| 2006 | 6 | 9 |
| 2007 | 4 | 12 |
| 2008 | 5 | 10 |
| 2009 | 2 | 17 |
| 2010 | 10 | 12 |
| 2011 | 13 | 12 |
| 2012 | 10 | 13 |
| 2013 | 11 | 13 |
| 2014 | 12 | 17 |
| 2015 | 19 | 30 |
| 2016 | 22 | 20 |
| 2017 | 30 | 32 |
| 2018 | 31 | 21 |
| 2019 | 25 | 19 |
| 2020 | 30 | 36 |
| 2021 | 12 | 29 |
| 2022 | 24 | 37 |
| 2023 | 21 | 24 |
| 2024 | 27 | 28 |
| 2025 | 21 | 13 |
| 2026 | 17 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device and semiconductor module15 Sep 2026US 12,740,440 B2LAPIS Technology Co., Ltd.
- Semiconductor device having chip capacitor connected to semiconductor chip with wires8 Sep 2026US 12,733,183 B2Renesas Electronics Corporation
- Wire bonds for galvanic isolation device18 Aug 2026US 12,713,629 B2Texas Instruments Incorporated
- Semiconductor device with wire including a surface metal layer covering a core metal11 Aug 2026US 12,708,043 B2Rohm Co., Ltd.
- Semiconductor device11 Aug 2026US 12,708,058 B2Rohm Co., Ltd.
- Stacked integrated passive device17 Sep 2026US 2026/0279687 A1MACOM Technology Solutions Holdings, Inc.
- Isolator including electrically floating intermediate electrode portion20 Aug 2026US 2026/0247638 A1Rohm Co., Ltd.
- Microelectronics device package with isolation and micro-transformer6 Aug 2026US 2026/0231819 A1Texas Instruments Incorporated
- Stacked capacitors for semiconductor devices and associated systems and methods28 May 2026US 2026/0150764 A1Micron Technology, Inc.
- Semiconductor package21 May 2026US 2026/0144148 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Single Paddle having a semiconductor device and a passive electronic component175US 6,335,564 B12002
- Apparatus and method for flat circuit assembly128US 5,600,175 ATexas Instruments Incorporated · 1997
- Apparatus and method for flat circuit assembly107US 5,729,053 ATexas Instruments Incorporated · 1998
- Integrated circuit device packages and substrates for making the packages97US 7,253,503 B1Amkor Technology, Inc. · 2007
- Semiconductor power module and power conversion device73US 5,608,595 AMitsubishi Denki Kabushiki Kaisha · 1997