Apparatus and method for flat circuit assembly
AssigneeTexas Instruments Incorporated
InventorKurt Orthmann
Life of this patent
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Abstract
A thin and flat integrated circuit assembly (10, 40) may be achieved by using a thin carrier (20) with shallow cavities (22, 24) for holding the integrated circuits (16) and/or discrete circuit components (14). The integrated circuits (16) and/or circuit components (14) may be friction fitted in the cavities (22, 24) or they may be secured therein by the use of adhesives and/or solder. Electrical connection between the integrated circuits (16) and circuit components (14) may be done with wire bonding, ribbon bonding, tape-automated bonding, lead frames, flip chip bonding, and/or conductive gluing of leads. The circuit assembly may then be accommodated into a credit card-sized packaging with standard dimensions set by the International Standards Organization.
Claims22
A batteryless flat integrated circuit assembly, comprising:
- at least one integrated circuit;
- a capacitor;
- a carrier having a thickness less than that of the integrated circuit and capacitor, said carrier defining shallow cavities for accommodating each of said integrated circuit and capacitor;
- and
- electrical connectors connecting said at least one integrated circuit and capacitor.
A method of assembly of integrated circuits and circuit components to not exceed 760 .mu.m package thickness, comprising the steps of:
- preparing a carrier of between 200 and 400 .mu.m by defining a cavity of appropriate size and dimensions for each of said integrated circuits and circuit components;
- positioning and securing said integrated circuits and circuit components in said respective cavities;
- and
- electrically connecting said integrated circuits and circuit components.
Dependencies are inferred from the claim text.