Single Paddle having a semiconductor device and a passive electronic component

Abstract

A semiconductor package and a corresponding method of forming this package are provided. The semiconductor package includes a paddle and a semiconductor device mounted on the paddle. A passive electronic component is also mounted on the paddle and spaced apart from the semiconductor device. Interconnects provide a conductive path from a bonding pad of the semiconductor device to a bonding pad of the passive electronic component such that the passive electronic component and semiconductor device are operatively connected.

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